At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Position Description: Deliver/implement IC project. The engineer should be able to act as a key team member
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Position Description: Specific duties include: -Responsible for verification plan define based on IP design SPEC. -Lead verification
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Position Description: Lead project verification. The engineer should be good at teamwork and able to help team
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Position: Lead Design Engineer Location: Nanjing Work scope: Responsible for the Highspeed Serdes and DDR IP EVB
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Design Engineer Job Description: 负责Highspeed Serdes 和 DDR IP 测试评估版的原理图和PCB 设计; 负责PCIE, USB, 10G-KR Serdes IP 一致性测试;
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Senior Principal Design Engineer – Frontend Position Description: 职位描述: Deliver/implement SoC and ASIC chip. The engineer should
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Join a growing and dynamic IP team and help lead the development of best in class digital
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. 工作内容: - 设计,模拟和验证10Gbps 以上的高速SerDes接口电路。 - 建立高速模拟电路模块的AMS模型和支持在数字集成中的IP联合验证。 - 定义IC 模块的性能指标和创建设计文档。 - 设计IC模块和指导layout布局。 - 芯片测试,性能验证和实验室调试。 - 团队分享设计经验和指导。 要求: 微电子,电路与系统等专业的硕士及以上学历,有扎实的电路分析理解能力。
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. 工作内容: - 设计,模拟和验证10Gbps 以上的高速SerDes接口电路。 - 建立高速模拟电路模块的AMS模型和支持在数字集成中的IP联合验证。 - 定义IC 模块的性能指标和创建设计文档。 - 设计IC模块和指导layout布局。 - 芯片测试,性能验证和实验室调试。 - 团队分享设计经验和指导。 要求: 微电子,电路与系统等专业的硕士及以上学历,有扎实的电路分析理解能力。