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Hardware Development 工作 在 中国

工作: 1 to 1 ,共有 1 工作
231

Principal System Engineer (TW10084826)

Robert Half (上海, 中国)

, and maintenance of systems hardware and software and related infrastructure. The ideal candidate will be...
Robert Half China
- 16天前16 days ago -




Sr Principal Engineer, Firmware(Lighting)

HARMAN International (Shenzhen, 中国)

Position Summary: We are looking for a new colleague to: Integrate and tailor software platform components to control light, movement, heat management
HARMAN International
- 21小时前21 hours ago -

Sr Principal Engineer, Firmware(CoC)

HARMAN International (Shenzhen, 中国)

Position Summary: This position is for a Senior Firmware Engineer with 6+ years of relevant experience. The position requires a self-motivated individ
HARMAN International
- 21小时前21 hours ago -

Process engineer

Vestas (Tianjin, 中国)

Description   We have more than 2,000 employees working in Tianjin manufacturing base, and we like to invite you to join us for brilliant future of wi
Vestas
- 16天前16 days ago -

Principal Engineer, Systems

Harman (Shenzhen, 中国)

Position Summary This position is within HARMAN’s Professional Division, based in Shenzhen Development Center (SDC). Harman is looking to hire the mos
Harman
- 12天前12 days ago -

Sr Principal Engineer, Firmware(V&C)

Harman (Shenzhen, 中国)

Position Summary: Harman is looking to hire the most passionate, innovative and driven engineers on the planet to drive the next generation of control
Harman
- 27天前27 days ago -

Sr Principal Engineer, Firmware(DSP)

Harman International (Shenzhen, 中国)

Sr Principal Engineer, Firmware(DSP) Apply now » + Apply now Email + Please wait. Date: Jan 26, 2018 Location: Shenzhen, China, CN Company: HARMAN Int
Harman international
- 1天前1 day ago -

Senior IT Engineer

Aon Hewitt (Shanghai, 中国)

Job Description Please apply with the email subject of HO - IT - Senior IT Engineer -Your Name   Job Title: Senior IT Engineer   Business Unit/Office:
Aon Hewitt
- 4天前4 days ago -

Principal Engineer, Firmware(CoC)

Harman International (Shenzhen, 中国)

Principal Engineer, Firmware(CoC) Apply now » + Apply now Email + Please wait. Date: Jan 26, 2018 Location: Shenzhen, China, CN Company: HARMAN Intern
Harman international
- 1天前1 day ago -
Hardware Development
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